JEDEC JESD22-A104E

$29.50

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JEDEC JESD22-A104E

$29.50

TEMPERATURE CYCLING
standard by JEDEC Solid State Technology Association, 10/01/2014

Format: PDF      In Stock

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Description

This standard provides a method for determining solid state devices capability to withstand extreme temperature cycling. This standard applies to single-, dual- and triple-chamber temperature cycling and covers component and solder interconnection testing. It should be noted that this standard does not cover or apply to thermal shock chambers. This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high- and low-temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.

Product Details

Published:
10/01/2014
Number of Pages:
18
File Size:
1 file , 250 KB

JEDEC JESD22-A104E

$29.50

Format: PDF      In Stock

Sale!
-50%

JEDEC JESD22-A104E

$29.50

Temperature Cycling
standard by JEDEC Solid State Technology Association, 11/01/2020

Format: PDF      In Stock

NOTE: Our website provide PDF immediately download, sometimes when the payment is processed and you did not receive the file, please do not worry and our customer service will send to you via email within 6 hours.

Description

This standard provides a method for determining solid state devices capability to withstand extreme temperature cycling. This standard applies to single-, dual- and triple-chamber temperature cycling and covers component and solder interconnection testing. It should be noted that this standard does not cover or apply to thermal shock chambers. This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high- and low-temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.

Product Details

Published:
11/01/2020
Number of Pages:
18
File Size:
1 file , 290 KB